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HiSilicon Kirin 8000 3DMark Benchmark score

HiSilicon Kirin 8000 has an 3DMark benchmark score of around 2447 points, which ranks it above its competitors like the Qualcomm Snapdragon 4 Gen 2 AE (which received 2441 marks in this test). It was used for the Huawei Nova 14 and the Huawei Nova 15 Max smartphones. The HiSilicon Kirin 8000 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Mali-G610 GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A77 2.4Ghz + 3 x Cortex-A77 2.19Ghz + 4 x Cortex-A55 1.84Ghz architecture, while the chip is made with 7 nm technology and has a 8 TDP. The built-in modem supports speeds up to 400 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 8000 3DMark Benchmark score
HiSilicon Kirin 8000 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 8000?

CPU3DMark benchmark scores
Qualcomm Snapdragon 778G+ 2490
MediaTek Dimensity 930 2487
Huawei HiSilicon Kirin 980 2486
Qualcomm Snapdragon 4 Gen 4 2465
Qualcomm Snapdragon 778G 2465
HiSilicon Kirin 8000 2447
Qualcomm Snapdragon 4 Gen 2 AE 2441
MediaTek Dimensity 7050 2432
MediaTek Dimensity 1080 2411
Qualcomm Snapdragon 4 Gen 2 2389
Qualcomm Snapdragon 855 Plus 2368

Specification

Processor nameHiSilicon Kirin 8000
Release Date12/12/2023
CPU Architecture1 x Cortex-A77 2.4Ghz + 3 x Cortex-A77 2.19Ghz + 4 x Cortex-A55 1.84Ghz
Number of Cores8
Clock Rate2.4 GHz
Chip technology7 nm
GPUMali-G610
The highest TDP8
Memory16 Gb
FeaturesKirin 5G modem
Upload Speed (up to)400 Mbps