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HiSilicon Kirin 8000 3DMark Benchmark score

HiSilicon Kirin 8000 has an 3DMark benchmark score of around 2447 points, which ranks it above its competitors like the Qualcomm Snapdragon 4 Gen 2 AE (which received 2441 marks in this test). It was used for the Huawei Nova 13 Pro and the Huawei Nova 13 smartphones. The HiSilicon Kirin 8000 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Mali-G610 GPU, and a 16 Gb memory support. The CPU is based on the 1 x Cortex-A77 2.4Ghz + 3 x Cortex-A77 2.19Ghz + 4 x Cortex-A55 1.84Ghz architecture, while the chip is made with 7 nm technology and has a 8 TDP. The built-in modem supports speeds up to 400 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 8000 3DMark Benchmark score
HiSilicon Kirin 8000 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 8000?

CPU3DMark benchmark scores
Qualcomm Snapdragon 782G 2557
Qualcomm Snapdragon 778G+ 2490
MediaTek Dimensity 930 2487
Huawei HiSilicon Kirin 980 2486
Qualcomm Snapdragon 778G 2465
HiSilicon Kirin 8000 2447
Qualcomm Snapdragon 4 Gen 2 AE 2441
MediaTek Dimensity 7050 2432
MediaTek Dimensity 1080 2411
Qualcomm Snapdragon 4 Gen 2 2389
Qualcomm Snapdragon 855 Plus 2368

Specification

Processor nameHiSilicon Kirin 8000
Release Date12/12/2023
CPU Architecture1 x Cortex-A77 2.4Ghz + 3 x Cortex-A77 2.19Ghz + 4 x Cortex-A55 1.84Ghz
Number of Cores8
Clock Rate2.4 GHz
Chip technology7 nm
GPUMali-G610
The highest TDP8
Memory16 Gb
FeaturesKirin 5G modem
Upload Speed (up to)400 Mbps