Qualcomm Snapdragon 855 Plus 3DMark Benchmark score
Qualcomm Snapdragon 855 Plus has an 3DMark benchmark score of around 2368 points, which ranks it above its competitors like the MediaTek Dimensity 820 (which received 2344 marks in this test). It was used for the Vivo NEX 3 and the Xiaomi Mi 9 Pro 5G 8 256Gb smartphones. The Qualcomm Snapdragon 855 Plus is a powerful processor with great specs, that boasts 8 cores, 2.96 GHz clock rate, Adreno 640 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.96 ГГц Cortex-A76 + 3x 2.42 ГГц Cortex-A76 + 4x 1.8 GHz Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 855 Plus?
Specification
Processor name | Qualcomm Snapdragon 855 Plus |
---|---|
Release Date | 7/15/2019 |
CPU Architecture | 1x 2.96 ГГц Cortex-A76 + 3x 2.42 ГГц Cortex-A76 + 4x 1.8 GHz Cortex-A55 |
Number of Cores | 8 |
Clock Rate | 2.96 GHz |
Chip technology | 7 nm |
GPU | Adreno 640 |
The highest TDP | 10 |
Memory | 16 Gb |
Features | Snapdragon X24 |
Upload Speed (up to) | 316 Mbps |