MediaTek Dimensity 8100 3DMark Benchmark score
MediaTek Dimensity 8100 has an 3DMark benchmark score of around 6213 points, which ranks it above its competitors like the HiSilicon Kirin 9000s (which received 6211 marks in this test). It was used for the Oppo Reno 9 Pro and the OnePlus Ace Racing Edition 8 256GB smartphones. The MediaTek Dimensity 8100 is a powerful processor with great specs, that boasts 8 cores, 2.85 GHz clock rate, Mali-G610 MC GPU, and a 16 Gb memory support. The CPU is based on the 4x Cortex-A78 2.85Ghz + 4x Cortex-A55 2Ghz architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Dimensity 8100?
Specification
Processor name | MediaTek Dimensity 8100 |
---|---|
Release Date | 3/2/2022 |
CPU Architecture | 4x Cortex-A78 2.85Ghz + 4x Cortex-A55 2Ghz |
Number of Cores | 8 |
Clock Rate | 2.85 GHz |
Chip technology | 5 nm |
GPU | Mali-G610 MC |
The highest TDP | 10 |
Memory | 16 Gb |
Features | Mediatek Custom Integrated 5G modem |
Upload Speed (up to) | 500 Mbps |