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MediaTek Helio G70 3DMark Benchmark score

MediaTek Helio G70 has an 3DMark benchmark score of around 593 points, which ranks it above its competitors like the MediaTek Helio P60 (which received 578 marks in this test). It was used for the Realme C25 and the Xiaomi Redmi 10 2022 smartphones. The MediaTek Helio G70 is a powerful processor with great specs, that boasts 8 cores, 2 GHz clock rate, Mali-G52 MC GPU, and a 8 Gb memory support. The CPU is based on the 2x Cortex-A75 (2 GHz) + 6x Cortex-A55 (1.7 GHz) architecture, while the chip is made with 10 nm technology and has a 5 TDP. The built-in modem supports speeds up to 100 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Helio G70 3DMark Benchmark score
MediaTek Helio G70 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Helio G70?

CPU3DMark benchmark scores
Qualcomm Snapdragon 730 668
Samsung Exynos 8890 658
Qualcomm Snapdragon 712 655
MediaTek Helio G91 607
MediaTek Helio G72 601
MediaTek Helio G70 593
MediaTek Helio P60 578
UNISOC Tiger T618 578
Samsung Exynos 9610 576
MediaTek Helio P65 573
MediaTek MT8788 566


Processor nameMediaTek Helio G70
Release Date1/15/2020
CPU Architecture2x Cortex-A75 (2 GHz) + 6x Cortex-A55 (1.7 GHz)
Number of Cores8
Clock Rate2 GHz
Chip technology10 nm
GPUMali-G52 MC
The highest TDP5
Memory8 Gb
FeaturesMediaTek modem
Upload Speed (up to)100 Mbps