MediaTek Helio G70 3DMark Benchmark score
MediaTek Helio G70 has an 3DMark benchmark score of around 593 points, which ranks it above its competitors like the MediaTek Helio G81 (which received 592 marks in this test). It was used for the Realme C25 and the Xiaomi Redmi 10 2022 smartphones. The MediaTek Helio G70 is a powerful processor with great specs, that boasts 8 cores, 2 GHz clock rate, Mali-G52 MC GPU, and a 8 Gb memory support. The CPU is based on the 2x Cortex-A75 (2 GHz) + 6x Cortex-A55 (1.7 GHz) architecture, while the chip is made with 10 nm technology and has a 5 TDP. The built-in modem supports speeds up to 100 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Helio G70?
Specification
Processor name | MediaTek Helio G70 |
---|---|
Release Date | 1/15/2020 |
CPU Architecture | 2x Cortex-A75 (2 GHz) + 6x Cortex-A55 (1.7 GHz) |
Number of Cores | 8 |
Clock Rate | 2 GHz |
Chip technology | 10 nm |
GPU | Mali-G52 MC |
The highest TDP | 5 |
Memory | 8 Gb |
Features | MediaTek modem |
Upload Speed (up to) | 100 Mbps |