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Samsung Exynos 8890 3DMark Benchmark score

Samsung Exynos 8890 has an 3DMark benchmark score of around 658 points, which ranks it above its competitors like the Qualcomm Snapdragon 712 (which received 655 marks in this test). It was used for the Meizu Pro 6 Plus 128 and the Meizu Pro 6 Edge smartphones. The Samsung Exynos 8890 is a powerful processor with great specs, that boasts 8 cores, 2.6 GHz clock rate, Mali T880MP GPU, and a 4 Gb memory support. The CPU is based on the 4x 2.6GHz Mongoose + 4x 2.3GHz Cortex-A53 architecture, while the chip is made with 14 nm technology and has a 5 TDP. The built-in modem supports speeds up to 150 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Samsung Exynos 8890 3DMark Benchmark score
Samsung Exynos 8890 3DMark Benchmark score

What is the 3DMark Benchmark score of Samsung Exynos 8890?

CPU3DMark benchmark scores
MediaTek Helio G85 714
Qualcomm Snapdragon 820 711
Qualcomm Snapdragon 670 691
MediaTek Helio G80 684
Qualcomm Snapdragon 730 668
Samsung Exynos 8890 658
Qualcomm Snapdragon 712 655
MediaTek Helio G91 607
MediaTek Helio G72 601
MediaTek Helio G70 593
MediaTek Helio P60 578


Processor nameSamsung Exynos 8890
Release Date11/12/2015
CPU Architecture4x 2.6GHz Mongoose + 4x 2.3GHz Cortex-A53
Number of Cores8
Clock Rate2.6 GHz
Chip technology14 nm
GPUMali T880MP
The highest TDP5
Memory4 Gb
FeaturesSamsung modem
Upload Speed (up to)150 Mbps