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MediaTek Dimensity 800U 3DMark Benchmark score

MediaTek Dimensity 800U has an 3DMark benchmark score of around 1602 points, which ranks it above its competitors like the MediaTek Helio G95 (which received 1477 marks in this test). It was used for the Oppo Reno5 Lite and the Realme Q2 smartphones. The MediaTek Dimensity 800U is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Arm Mali-G57 GPU, and a 12 Gb memory support. The CPU is based on the 2x Cortex-A76 (2.4 GHz) + 6x Cortex-A55 (2 GHz) architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 211 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 800U 3DMark Benchmark score
MediaTek Dimensity 800U 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 800U?

CPU3DMark benchmark scores
UNISOC T820 1772
Qualcomm Snapdragon 765G 1717
Samsung Exynos 1330 1702
Qualcomm Snapdragon 765 1669
Apple A9 Twister 1659
MediaTek Dimensity 800U 1602
MediaTek Helio G95 1477
Qualcomm Snapdragon 845 1445
Huawei HiSilicon Kirin 810 1422
MediaTek Helio G90T 1318
MediaTek Dimensity 720 1242

Specification

Processor nameMediaTek Dimensity 800U
Release Date8/15/2020
CPU Architecture2x Cortex-A76 (2.4 GHz) + 6x Cortex-A55 (2 GHz)
Number of Cores8
Clock Rate2.4 GHz
Chip technology7 nm
GPUArm Mali-G57
The highest TDP10
Memory12 Gb
FeaturesMediaTek modem
Upload Speed (up to)211 Mbps