MediaTek Dimensity 8250 3DMark Benchmark score
MediaTek Dimensity 8250 has an 3DMark benchmark score of around 6311 points, which ranks it above its competitors like the Qualcomm Snapdragon 7 Gen 3 (which received 6255 marks in this test). It was used for the Oppo Reno 12 and the Oppo Reno 12 smartphones. The MediaTek Dimensity 8250 is a powerful processor with great specs, that boasts 8 cores, 3.1 GHz clock rate, Mali-G610 MC GPU, and a 16 Gb memory support. The CPU is based on the 1x Cortex-A710 3.1Ghz + 1x Cortex-A710 3.0Ghz + 4x Cortex-A510 2Ghz architecture, while the chip is made with 4 nm technology and has a 10 TDP. The built-in modem supports speeds up to 1000 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Dimensity 8250?
Specification
| Processor name | MediaTek Dimensity 8250 |
|---|---|
| Release Date | 11/20/2024 |
| CPU Architecture | 1x Cortex-A710 3.1Ghz + 1x Cortex-A710 3.0Ghz + 4x Cortex-A510 2Ghz |
| Number of Cores | 8 |
| Clock Rate | 3.1 GHz |
| Chip technology | 4 nm |
| GPU | Mali-G610 MC |
| The highest TDP | 10 |
| Memory | 16 Gb |
| Features | MediaTek Custom Integrated 5G modem |
| Upload Speed (up to) | 1000 Mbps |