HiSilicon Kirin 9000s 3DMark Benchmark score
HiSilicon Kirin 9000s has an 3DMark benchmark score of around 6211 points, which ranks it above its competitors like the MediaTek Dimensity 8200 (which received 6188 marks in this test). It was used for the Huawei Mate 60 Pro Plus and the Huawei Mate 60 Pro smartphones. The HiSilicon Kirin 9000s is a powerful processor with great specs, that boasts 12 cores, 3.3 GHz clock rate, Maleoon 910 GPU, and a 18 Gb memory support. The CPU is based on the 6 x ARM Cortex-A78AE 3.3GHz + 4 x ARM Cortex A510 + 2 x Cortex-A34 architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 300 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of HiSilicon Kirin 9000s?
Specification
Processor name | HiSilicon Kirin 9000s |
---|---|
Release Date | 08/28/2023 |
CPU Architecture | 6 x ARM Cortex-A78AE 3.3GHz + 4 x ARM Cortex A510 + 2 x Cortex-A34 |
Number of Cores | 12 |
Clock Rate | 3.3 GHz |
Chip technology | 5 nm |
GPU | Maleoon 910 |
The highest TDP | 10 |
Memory | 18 Gb |
Features | HiSilicon modem |
Upload Speed (up to) | 300 Mbps |