0
Compare:
Compare with:
Please enter model name or part of it
 
AED درهم BHD دب BRL R$ CNY ¥ CZK Kč DKK kr EUR € GBP £ IDR Rp ILS ₪ INR ₹ JPY ¥ KRW ₩ KWD د.ك NOK kr PLN zł QAR ريال RUB руб SAR درهم SEK kr TRY ₺ UAH грн
You were probably searching for:
Reviews

HiSilicon Kirin 9000s 3DMark Benchmark score

HiSilicon Kirin 9000s has an 3DMark benchmark score of around 6211 points, which ranks it above its competitors like the MediaTek Dimensity 8000 (which received 6107 marks in this test). It was used for the Huawei Mate 60 Pro Plus and the Huawei Mate 60 Pro smartphones. The HiSilicon Kirin 9000s is a powerful processor with great specs, that boasts 12 cores, 3.3 GHz clock rate, Maleoon 910 GPU, and a 18 Gb memory support. The CPU is based on the 6 x ARM Cortex-A78AE 3.3GHz + 4 x ARM Cortex A510 + 2 x Cortex-A34 architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 300 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 9000s 3DMark Benchmark score
HiSilicon Kirin 9000s 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 9000s?

CPU3DMark benchmark scores
HiSilicon Kirin 9010 6453
Google Tensor G2 6398
Qualcomm Snapdragon 7 Gen 3 6255
Google Tensor 6220
MediaTek Dimensity 8100 6213
HiSilicon Kirin 9000s 6211
MediaTek Dimensity 8000 6107
Huawei HiSilicon Kirin 9000 6041
Huawei HiSilicon Kirin 9000E 5655
Qualcomm Snapdragon 888 Plus 5622
Samsung Exynos 1080 5587

Specification

Processor nameHiSilicon Kirin 9000s
Release Date08/28/2023
CPU Architecture6 x ARM Cortex-A78AE 3.3GHz + 4 x ARM Cortex A510 + 2 x Cortex-A34
Number of Cores12
Clock Rate3.3 GHz
Chip technology5 nm
GPUMaleoon 910
The highest TDP10
Memory18 Gb
FeaturesHiSilicon modem
Upload Speed (up to)300 Mbps