Qualcomm Snapdragon 617 3DMark Benchmark score
Qualcomm Snapdragon 617 has an 3DMark benchmark score of around 69 points, which ranks it above its competitors like the Qualcomm Snapdragon 808 (which received 69 marks in this test). It was used for the Huawei G9 Lite and the Coolpad Max smartphones. The Qualcomm Snapdragon 617 is a powerful processor with great specs, that boasts 8 cores, 1.7 GHz clock rate, Adreno 405 GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A53 1,7 GHz + 4 x ARM Cortex-A53 1 GHz architecture, while the chip is made with 28 nm technology and has a 4 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of Qualcomm Snapdragon 617?
Specification
Processor name | Qualcomm Snapdragon 617 |
---|---|
Release Date | 04/20/2014 |
CPU Architecture | 4 x ARM Cortex-A53 1,7 GHz + 4 x ARM Cortex-A53 1 GHz |
Number of Cores | 8 |
Clock Rate | 1.7 GHz |
Chip technology | 28 nm |
GPU | Adreno 405 |
The highest TDP | 4 |
Memory | 4 Gb |
Features | Snapdragon X5 |
Upload Speed (up to) | 50 Mbps |