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Qualcomm Snapdragon 617 3DMark Benchmark score

Qualcomm Snapdragon 617 has an 3DMark benchmark score of around 69 points, which ranks it above its competitors like the Qualcomm Snapdragon 808 (which received 69 marks in this test). It was used for the Huawei G9 Lite and the Coolpad Max smartphones. The Qualcomm Snapdragon 617 is a powerful processor with great specs, that boasts 8 cores, 1.7 GHz clock rate, Adreno 405 GPU, and a 4 Gb memory support. The CPU is based on the 4 x ARM Cortex-A53 1,7 GHz + 4 x ARM Cortex-A53 1 GHz architecture, while the chip is made with 28 nm technology and has a 4 TDP. The built-in modem supports speeds up to 50 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 617 3DMark Benchmark score
Qualcomm Snapdragon 617 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 617?

CPU3DMark benchmark scores
Marvell PXA1928 74
MediaTek MT6592 72
MediaTek MT6737T 72
MediaTek MT8783 71
MediaTek MT6737 69
Qualcomm Snapdragon 617 69
Qualcomm Snapdragon 808 69
Rockchip RK3328 69
UNISOC SC9832E 69
Qualcomm Snapdragon 616 68
UNISOC SC7731E 68

Specification

Processor nameQualcomm Snapdragon 617
Release Date04/20/2014
CPU Architecture4 x ARM Cortex-A53 1,7 GHz + 4 x ARM Cortex-A53 1 GHz
Number of Cores8
Clock Rate1.7 GHz
Chip technology28 nm
GPUAdreno 405
The highest TDP4
Memory4 Gb
FeaturesSnapdragon X5
Upload Speed (up to)50 Mbps