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MediaTek Dimensity 8000 3DMark Benchmark score

MediaTek Dimensity 8000 has an 3DMark benchmark score of around 6107 points, which ranks it above its competitors like the Huawei HiSilicon Kirin 9000 (which received 6041 marks in this test). It was used for the Oppo K10 5G and the Oppo K10 5G 12 256GB smartphones. The MediaTek Dimensity 8000 is a powerful processor with great specs, that boasts 8 cores, 2.75 GHz clock rate, Mali-G610 MC GPU, and a 16 Gb memory support. The CPU is based on the 4x Cortex-A78 2.75Ghz + 4x Cortex-A55 2Ghz architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

MediaTek Dimensity 8000 3DMark Benchmark score
MediaTek Dimensity 8000 3DMark Benchmark score

What is the 3DMark Benchmark score of MediaTek Dimensity 8000?

CPU3DMark benchmark scores
Google Tensor G2 6398
Qualcomm Snapdragon 7 Gen 3 6255
Google Tensor 6220
MediaTek Dimensity 8100 6213
HiSilicon Kirin 9000s 6211
MediaTek Dimensity 8000 6107
Huawei HiSilicon Kirin 9000 6041
Huawei HiSilicon Kirin 9000E 5655
Qualcomm Snapdragon 888 Plus 5622
Samsung Exynos 1080 5587
Samsung Exynos 2100 5543

Specification

Processor nameMediaTek Dimensity 8000
Release Date3/10/2022
CPU Architecture4x Cortex-A78 2.75Ghz + 4x Cortex-A55 2Ghz
Number of Cores8
Clock Rate2.75 GHz
Chip technology5 nm
GPUMali-G610 MC
The highest TDP10
Memory16 Gb
FeaturesMediatek Custom Integrated 5G modem
Upload Speed (up to)500 Mbps