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Qualcomm Snapdragon 865 Plus 3DMark Benchmark score

Qualcomm Snapdragon 865 Plus has an 3DMark benchmark score of around 4187 points, which ranks it above its competitors like the MediaTek Dimensity 1200 (which received 4178 marks in this test). It was used for the Realme Z7 and the Asus ROG Phone 3 12 128GB 865 Plus smartphones. The Qualcomm Snapdragon 865 Plus is a powerful processor with great specs, that boasts 8 cores, 3.1 GHz clock rate, Adreno 650 GPU, and a 16 Gb memory support. The CPU is based on the 1x 3.1 GHz ARM Cortex-A77 + 3x 2.42 GHz ARM Cortex-A77 + 4x1.8 GHz ARM Cortex-A55 architecture, while the chip is made with 7 nm technology and has a 10 TDP. The built-in modem supports speeds up to 316 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

Qualcomm Snapdragon 865 Plus 3DMark Benchmark score
Qualcomm Snapdragon 865 Plus 3DMark Benchmark score

What is the 3DMark Benchmark score of Qualcomm Snapdragon 865 Plus?

CPU3DMark benchmark scores
MediaTek Dimensity 8050 4538
Qualcomm Snapdragon 865 4378
Qualcomm Snapdragon 870 4265
MediaTek Dimensity 8020 4236
MediaTek Dimensity 1300 4197
Qualcomm Snapdragon 865 Plus 4187
MediaTek Dimensity 1200 4178
MediaTek Dimensity 1100 3980
Qualcomm Snapdragon 7 Gen 1 3894
Samsung Exynos 990 3822
MediaTek Dimensity 1000 Plus 3735

Specification

Processor nameQualcomm Snapdragon 865 Plus
Release Date7/8/2020
CPU Architecture1x 3.1 GHz ARM Cortex-A77 + 3x 2.42 GHz ARM Cortex-A77 + 4x1.8 GHz ARM Cortex-A55
Number of Cores8
Clock Rate3.1 GHz
Chip technology7 nm
GPUAdreno 650
The highest TDP10
Memory16 Gb
FeaturesSnapdragon X55
Upload Speed (up to)316 Mbps