MediaTek Dimensity 810 3DMark Benchmark score
MediaTek Dimensity 810 has an 3DMark benchmark score of around 1228 points, which ranks it above its competitors like the Qualcomm Snapdragon 695 (which received 1211 marks in this test). It was used for the Realme 8s and the Honor Play 6T Pro smartphones. The MediaTek Dimensity 810 is a powerful processor with great specs, that boasts 8 cores, 2.4 GHz clock rate, Mali-G57MP GPU, and a 16 Gb memory support. The CPU is based on the 4x Cortex-A76 (2.4 GHz) + 4x Cortex-A55 (2 GHz) architecture, while the chip is made with 7 nm technology and has a 8 TDP. The built-in modem supports speeds up to 200 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of MediaTek Dimensity 810?
Specification
Processor name | MediaTek Dimensity 810 |
---|---|
Release Date | 8/10/2021 |
CPU Architecture | 4x Cortex-A76 (2.4 GHz) + 4x Cortex-A55 (2 GHz) |
Number of Cores | 8 |
Clock Rate | 2.4 GHz |
Chip technology | 7 nm |
GPU | Mali-G57MP |
The highest TDP | 8 |
Memory | 16 Gb |
Features | MediaTek 5G modem |
Upload Speed (up to) | 200 Mbps |