HiSilicon Kirin 9030S 3DMark Benchmark score
HiSilicon Kirin 9030S has an 3DMark benchmark score of around points, which ranks it above its competitors like the MediaTek Dimensity 7000 (which received 0 marks in this test). It was used for the Huawei Pura 90 Pro and the Huawei Pura 90 Pro smartphones. The HiSilicon Kirin 9030S is a powerful processor with great specs, that boasts 8 cores, 3 GHz clock rate, Maleoon 920 GPU, and a 16 Gb memory support. The CPU is based on the 1x 3 ГГц Taishan Big + 3x 2.27 ГГц Taishan Mid + 4x 1.72 ГГц Taishan Little architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 3500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of HiSilicon Kirin 9030S?
Specification
| Processor name | HiSilicon Kirin 9030S |
|---|---|
| Release Date | 04/20/2026 |
| CPU Architecture | 1x 3 ГГц Taishan Big + 3x 2.27 ГГц Taishan Mid + 4x 1.72 ГГц Taishan Little |
| Number of Cores | 8 |
| Clock Rate | 3 GHz |
| Chip technology | 5 nm |
| GPU | Maleoon 920 |
| The highest TDP | 10 |
| Memory | 16 Gb |
| Features | Balong 6000 |
| Upload Speed (up to) | 3500 Mbps |