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HiSilicon Kirin 9030S 3DMark Benchmark score

HiSilicon Kirin 9030S has an 3DMark benchmark score of around points, which ranks it above its competitors like the MediaTek Dimensity 7000 (which received 0 marks in this test). It was used for the Huawei Pura 90 Pro and the Huawei Pura 90 Pro smartphones. The HiSilicon Kirin 9030S is a powerful processor with great specs, that boasts 8 cores, 3 GHz clock rate, Maleoon 920 GPU, and a 16 Gb memory support. The CPU is based on the 1x 3 ГГц Taishan Big + 3x 2.27 ГГц Taishan Mid + 4x 1.72 ГГц Taishan Little architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 3500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 9030S 3DMark Benchmark score
HiSilicon Kirin 9030S 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 9030S?

CPU3DMark benchmark scores
Apple A18 Pro 0
Apple A19 0
Apple A19 Pro 0
Apple A18 0
Google Tensor G4 0
HiSilicon Kirin 9030S 0
MediaTek Dimensity 7000 0
MediaTek Helio G36 0
MediaTek Helio G37 0
MediaTek Helio P18 0
Samsung Exynos 1480 0

Specification

Processor nameHiSilicon Kirin 9030S
Release Date04/20/2026
CPU Architecture1x 3 ГГц Taishan Big + 3x 2.27 ГГц Taishan Mid + 4x 1.72 ГГц Taishan Little
Number of Cores8
Clock Rate3 GHz
Chip technology5 nm
GPUMaleoon 920
The highest TDP10
Memory16 Gb
FeaturesBalong 6000
Upload Speed (up to)3500 Mbps