HiSilicon Kirin 9030 Pro 3DMark Benchmark score
HiSilicon Kirin 9030 Pro has an 3DMark benchmark score of around points, which ranks it above its competitors like the HiSilicon Kirin 9030S (which received 0 marks in this test). It was used for the Huawei Pura X Max and the Huawei Pura X Max smartphones. The HiSilicon Kirin 9030 Pro is a powerful processor with great specs, that boasts 8 cores, 2.75 GHz clock rate, Maleoon 935 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.75GHz Taishan Big + 4x 2.27GHz Taishan Mid + 4x 1.72GHz Taishan Little architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 3500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.
What is the 3DMark Benchmark score of HiSilicon Kirin 9030 Pro?
Specification
| Processor name | HiSilicon Kirin 9030 Pro |
|---|---|
| Release Date | 11/25/2025 |
| CPU Architecture | 1x 2.75GHz Taishan Big + 4x 2.27GHz Taishan Mid + 4x 1.72GHz Taishan Little |
| Number of Cores | 8 |
| Clock Rate | 2.75 GHz |
| Chip technology | 5 nm |
| GPU | Maleoon 935 |
| The highest TDP | 10 |
| Memory | 16 Gb |
| Features | Balong 6000 |
| Upload Speed (up to) | 3500 Mbps |