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HiSilicon Kirin 9030 Pro 3DMark Benchmark score

HiSilicon Kirin 9030 Pro has an 3DMark benchmark score of around points, which ranks it above its competitors like the HiSilicon Kirin 9030S (which received 0 marks in this test). It was used for the Huawei Pura X Max and the Huawei Pura X Max smartphones. The HiSilicon Kirin 9030 Pro is a powerful processor with great specs, that boasts 8 cores, 2.75 GHz clock rate, Maleoon 935 GPU, and a 16 Gb memory support. The CPU is based on the 1x 2.75GHz Taishan Big + 4x 2.27GHz Taishan Mid + 4x 1.72GHz Taishan Little architecture, while the chip is made with 5 nm technology and has a 10 TDP. The built-in modem supports speeds up to 3500 Mbps. We know you want to see how it results compares with other chips out there, so we've included a datasheet below.

HiSilicon Kirin 9030 Pro 3DMark Benchmark score
HiSilicon Kirin 9030 Pro 3DMark Benchmark score

What is the 3DMark Benchmark score of HiSilicon Kirin 9030 Pro?

CPU3DMark benchmark scores
Apple A18 Pro 0
Apple A19 0
Apple A19 Pro 0
Apple A18 0
Google Tensor G4 0
HiSilicon Kirin 9030 Pro 0
HiSilicon Kirin 9030S 0
MediaTek Dimensity 7000 0
MediaTek Helio G36 0
MediaTek Helio G37 0
MediaTek Helio P18 0

Specification

Processor nameHiSilicon Kirin 9030 Pro
Release Date11/25/2025
CPU Architecture1x 2.75GHz Taishan Big + 4x 2.27GHz Taishan Mid + 4x 1.72GHz Taishan Little
Number of Cores8
Clock Rate2.75 GHz
Chip technology5 nm
GPUMaleoon 935
The highest TDP10
Memory16 Gb
FeaturesBalong 6000
Upload Speed (up to)3500 Mbps